By Aida Todri-Sanial,Jean Dijon,Antonio Maffucci

This e-book offers a single-source reference at the use of carbon nanotubes (CNTs) as interconnect fabric for horizontal, on-chip and 3D interconnects. The authors exhibit the makes use of of bundles of CNTs, as cutting edge accomplishing fabric to manufacture interconnect through-silicon vias (TSVs), in an effort to enhance the functionality, reliability and integration of 3D built-in circuits (ICs). This ebook should be first to supply a coherent assessment of exploiting carbon nanotubes for 3D interconnects protecting points from processing, modeling, simulation, characterization and purposes. assurance additionally incorporates a thorough presentation of the appliance of CNTs as horizontal on-chip interconnects that may possibly revolutionize the nanoelectronics undefined. This e-book is a must-read for somebody drawn to the cutting-edge on exploiting carbon nanotubes for interconnects for either second and 3D built-in circuits.

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